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SOIL PROCESSING FOR LAVENDER PLANT

1- Chisel Plow

In some soil and climatic conditions, the thickness of the soil layer is 8-10 cm, just below the soil layer that is cultivated at the same depth every year. a waterproof hard layer is formed. With the formation of this layer called the base stone, it becomes difficult for the water to leak into the lower layers of the soil and prevents the root development of the plant. Therefore, rain and snow water falling on the soil makes it difficult to infiltrate the lower layers of the soil, causing the water to flow away from the soil surface and cause erosion. For this reason, the base stone must be broken at regular intervals. This work is done with special body plows called subsoilers. The machining body of this tool consists of a wedge-shaped end bar attached to a vertical and solid strut. The working width of the tool should be such that it breaks the hard layer (base stone). To achieve this, the depth of the hard layer should be determined beforehand. Dipkazan; If it needs to be pulled at certain intervals, it should be pulled in one direction, secondly, it should be pulled perpendicular to the direction taken first and at certain intervals. In heavy clay soils, a ball-shaped or cylindrical piece is tied to the back of the bottom iron in the soil, so that the hard layer is better blasted in the soil and the aeration of the soil and the movement of the water in the soil is facilitated by creating gaps where this piece passes at a certain depth.

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2- Plow

It is one of the most basic agricultural equipment used for plowing the field and used by attaching to the back of a tractor, enabling the soil to be turned upside down and ready for planting. In the field plowed with a plow, the inefficient soil in the upper part passes to the bottom and the rested fertile soil in the lower part moves to the upper part and changes its place.

3- Disc Harrow

After the soil is plowed with the plow, the disc harrow breaks the clods and provides a better planting by smoothing the field surface.

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